Used ASM Dragon 2300 Thin Flim Deposition Equipment

The ASM Dragon 2300 is a plasma-enhanced chemical vapor deposition (PECVD) system designed for 300mm (12-inch) wafers. Introduced by ASM Japan—a subsidiary of ASM International—the system was announced as being ready for high-volume manufacturing (HVM) in late 2002.

Core Positioning: A Compact, High-Throughput PECVD Platform

The fundamental design philosophy of the Dragon 2300 is to deliver high throughput and maximum uptime within the smallest possible footprint. It utilizes a dual-chamber architecture, where each reaction chamber features independent process control. This configuration ensures consistent thin-film deposition performance while enabling symmetrical processing, thereby boosting overall production capacity. The system is primarily used for depositing dielectric thin films on 300mm wafers, including processes based on TEOS or silane, as well as the deposition of SiC hard masks and low-k dielectric films (such as those in the Aurora series).

Key Features

Independent Dual-Chamber Control: The symmetrical dual-chamber design allows for independent temperature and gas-flow control in each chamber, balancing high throughput with process consistency.

Compact Footprint and Low Cost of Ownership (CoO): Marketed as having the smallest footprint among HVM-class PECVD tools, the system also offers low energy consumption and an optimized, minimal cost of ownership.

Modular Maintenance Design: A unique modular concept facilitates rapid maintenance, reducing downtime and increasing equipment utilization (uptime).

Summary

The Dragon 2300 is a compact platform developed by ASM for high-volume 300mm PECVD applications. By combining dual-chamber throughput, space efficiency, and a broad process range—covering TEOS, SiC hard masks, and low-k films—it serves the dielectric thin-film deposition requirements essential for the manufacturing of advanced memory and logic devices.