Used ASM XP8® DCM™ PEALD Thin Flim Deposition Equipment

The ASM XP8® DCM™ PEALD is a high-productivity 300mm plasma-enhanced atomic layer deposition (PEALD) system designed for advanced semiconductor manufacturing. Its core architecture supports up to four Dual-Chamber Modules (DCMs)—integrating as many as eight reaction chambers within a compact footprint—to deliver high-throughput production.

Purpose-built for the deposition of dielectric thin films, such as SiO, SiN, and TiO, the system is ideally suited for applications including low-temperature spacers for multi-patterning, gate oxides, and contact-hole liners and gap-fill. Each reaction chamber is independently controllable; combined with a small-volume chamber design, this ensures excellent wafer-to-wafer repeatability while optimizing gas utilization and processing speed. Furthermore, the system’s easy-access chamber design and low cost of ownership (CoO) offer both efficient maintenance and economic viability for high-volume manufacturing.

In short, this is a PEALD production platform distinguished by its high productivity and process flexibility, serving as a complementary solution to the XP4 Pulsar system, which is geared toward high-k metal gate (HKMG) applications.