Used ASM XP8® QCM PEALD

This is a PEALD (Plasma-Enhanced Atomic Layer Deposition) system within ASM’s XP8 platform, designed specifically for ultra-high throughput. Its core feature is the Quad-Chamber Module (QCM)—a module integrating four individual reaction chambers. A single platform can be configured with up to four QCMs, enabling the simultaneous processing of 16 300mm wafers and delivering exceptional mass-production efficiency within a compact footprint.

In terms of process application, the system focuses on the deposition of dielectric thin films for advanced logic and memory chips. It supports PEALD processes for materials such as silicon oxide and silicon nitride, with typical applications including low-temperature spacer layers for multi-patterning, liner layers, hard masks, and gap-filling for high-aspect-ratio structures. The system retains the XP8 platform’s signature small-volume reaction chamber design, which balances high precursor utilization efficiency with excellent wafer-to-wafer repeatability, while also facilitating rapid maintenance to help manage the total cost of ownership.

In short, this is a high-throughput PEALD production platform defined by its "quad-chamber module, 16-wafer parallel processing" architecture. It serves as a high-capacity complement to the previously discussed DCM (Dual-Chamber Module) version, which features dual-chamber modules and a maximum capacity of eight chambers.