Used novellus Thin Flim Deposition Equipment vector express

The Novellus (now part of Lam Research) Vector Express is a 300mm plasma-enhanced chemical vapor deposition (PECVD) system. Launched in 2007, it serves as an upgraded version of the existing Vector platform, optimized for the high-volume manufacturing of ultra-thin films. While not an atomic layer deposition (ALD) tool, it is primarily designed for the deposition of dielectric films used in logic and memory chips at the 45nm node and beyond.

Key innovations include "SmartSoak" temperature control and the MSSP (Multi-Station Sequential Processing) architecture. The most critical advancement in the Vector Express is the decoupling of wafer heating from the film deposition process. In traditional multi-station sequential processing, the time required to heat the wafer often exceeds the time needed for the actual deposition of an ultra-thin film (for instance, depositing a 10–20nm TEOS oxide layer at a single station might take only 3–5 seconds, while heating the wafer could take 10 seconds). SmartSoak utilizes the first station exclusively for temperature stabilization and outgassing, ensuring that subsequent deposition occurs under uniform thermal conditions. This simultaneously improves defect rates and film thickness uniformity, while boosting throughput by up to 40%.

In terms of process applications, the system can deposit a wide range of front-end and back-end dielectric films, including anti-reflective layers, diffusion barriers, and spacer oxides. Its specialized configuration for Ashable Hard Masks (AHM) excels in high-aspect-ratio patterning for 193nm lithography and has been deployed in the high-volume production lines of several major memory chip manufacturers. The system saw strong market adoption, with over 100 units shipped in its first year; it was adopted by eight of the world’s top ten semiconductor manufacturers (by capital expenditure) and received the 2008 CVD Equipment Performance Award from TSMC.