Used TEL Episode™ 2 DMR Vertical Batch Furnace Deposition Platform

The TEL Episode™ 2 DMR is a vertical batch furnace deposition platform from Tokyo Electron (TEL) designed for wafers 200mm in size and smaller. As a next-generation model in the Episode series, it emphasizes high throughput and process flexibility, catering to power devices, analog chips, and mature-node manufacturing lines.

Process Capabilities: The system supports various deposition modes, including ALD and CVD, and can deposit dielectric thin films such as silicon oxide and silicon nitride. These are used for applications including gate dielectrics, sidewall spacers, hard masks, and passivation layers. Its batch architecture allows for the processing of dozens to hundreds of wafers per tube, offering high throughput and low cost-per-wafer—ideal for high-volume production environments where throughput is critical.

Design Focus: Building upon the Episode™ 1, the Episode™ 2 DMR features enhanced process control and improved tool uptime. It incorporates multi-zone temperature control and low-pressure processing capabilities, while supporting multiple wafer sizes (100/150/200mm) to facilitate flexible production line transitions. The "DMR" suffix denotes a specific configuration or process-enhanced variant within the platform; while official details are limited, the system is positioned as a batch-type, high-volume deposition tool for mature-node and power semiconductor applications.

In short, it is a high-throughput, batch-style ALD/CVD platform within the TEL Episode series, designed for mature technology nodes. It represents a different production paradigm and application segment compared to the single-wafer, high-k deposition equipment from ASM that you previously inquired about.