ASM IS8912DA

The IS8912DA is a fully automated die bonder from ASM. Based on existing used equipment records, it was primarily used in production lines from around 2006 to 2012, supporting 6- to 12-inch wafer processing.

Technology and Configuration: This model employs a servo-controlled bonding head and a proprietary vision system for identifying and tracking bonding positions. The working area is approximately 870 × 670 mm, and it features a dual-mode station capacity. Some sources indicate it has a 7-inch color touchscreen interface and integrated production data collection capabilities, tracking parameters such as temperature, speed, and bonding angle. Regarding ultrasonic bonding capabilities, records mention a standard operating frequency of up to 5.5 MHz with adjustable power, suitable for avionics and small electronic component packaging.

Process Compatibility: The equipment supports bonding of components of various materials and sizes, and has a wide temperature control setting range to adapt to different substrates and process requirements. Some training materials indicate that this machine is used in the chip mounting process on the production line, involving precise control of parameters such as ejector pin specifications, nozzle models, scribing needles, and bonding pressure.