The wafer ring device in Besi's die bonder is a core component of the wafer supply system. It holds the blue film on the diced wafer and precisely delivers the wafer ring to the die feeding position, where the ejector pin mechanism pierces the blue film and ejects the die. In automated production lines, this device is also involved in the feeding of full wafer rings and the recycling of empty wafer rings to ensure the continuity of the die bonding cycle. Its positioning accuracy directly affects the die pick-up success rate and die bonding efficiency.
