Idivayisi yendandatho ye-wafer ku-die bonder kaBesi iyisici esiyinhloko sohlelo lokuhlinzeka nge-wafer. Ibamba ifilimu eluhlaza okwesibhakabhaka ku-wafer eqoshiwe futhi iletha ngokunembile indandatho ye-wafer endaweni yokondla nge-die, lapho indlela yephini ye-ejector ibhoboza khona ifilimu eluhlaza okwesibhakabhaka bese ikhipha i-die. Emigqeni yokukhiqiza ezenzakalelayo, le divayisi ibandakanyeka nasekuphakeleni amasongo e-wafer agcwele kanye nokusetshenziswa kabusha kwamasongo e-wafer angenalutho ukuqinisekisa ukuqhubeka komjikelezo we-die bonding. Ukunemba kwayo kokubeka kuthinta ngqo izinga lempumelelo yokuthathwa kwe-die kanye nokusebenza kahle kwe-die bonding.
