Isixhobo seringi ye-wafer kwi-die bonder kaBesi siyinxalenye ephambili yenkqubo yokubonelela nge-wafer. Sibamba ifilimu eluhlaza okwesibhakabhaka kwi-wafer eqoshiweyo kwaye sihambisa ngokuchanekileyo iringi ye-wafer kwindawo yokutya ye-die, apho i-ejector pin mechanism ihlaba ifilimu eluhlaza okwesibhakabhaka kwaye ikhuphe i-die. Kwimigca yemveliso ezenzekelayo, esi sixhobo sikwabandakanyeka ekutyisweni kweeringi ze-wafer ezipheleleyo kunye nokurisayikilishwa kweeringi ze-wafer ezingenanto ukuqinisekisa ukuqhubeka komjikelo we-die bonding. Ukuchaneka kwayo kwindawo ethile kuchaphazela ngokuthe ngqo izinga lempumelelo ye-die pick-up kunye nokusebenza kakuhle kwe-die bonding.
