I-ASM MS90 iyisistimu yokuhlunga ama-die e-wafer-based wafer-based fully automated, eyenzelwe kakhulu ukuhlukaniswa nokukhetha ama-dies e-semiconductor. Inesingalo sokukhetha nokubeka esinekhanda eliphindwe kabili esiqhutshwa yizinjini eziqondile, isekela ama-dies asukela ku-0.15 mm kuya ku-5 mm square, inikeza ukunemba okujwayelekile kokubeka i-XY okungu-±38 µm, futhi ingacubungula ama-wafer afinyelela ku-8 amayintshi ububanzi.
I-EPM (Electronic Pick Module), ngokubambisana nama-linear motors kanye nama-direct-drive motors, ivumela ukubeka i-XY ngendlela enembile.
